Multi Layer High Density Flexible Circuits

• Metrigraphics
• Wilmington

Multi Layer High Density Flexible Circuits

Metriform II is DRC's technique for the selective application of several photolithographic processes in combination with thick and thin film techniques to create custom, high-density passive circuits or compact assemblies.

Metriform II Technology includes:

• Thin film (additive) circuitry - Combinations of sputtered, electroformed, lift-off evaporation, dry or wet etching, lamination, and silk screening.
• Fine lines - DRC specializes in line widths from .001" (25.4 microns) and down. Line widths and spaces of .0004" (10 microns) are demonstrated on the free sample. Circuitry on or over substrate edges is not unusual.
• Multi-layer construction - Thin glass, Kapton, and liquid polyamides are common dielectrics. Many others screened, thin-film, or sputtered dielectrics are also available.
• Special substrates - We have worked with glass, quartz, fused silica, alumina, sapphire, stainless steel, Kapton, FR-4, G-10, copper clad invar, special optical materials, as well as machined/polished alloys. A wide variety of sizes and shapes can be accommodated.