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Intel, Siemens forge 3-year partnership for advanced chip manufacturing efficiency
Industry News- Dec 06,23
Intel is undergoing a multi-billion-dollar transformation in its manufacturing operations, which includes a shift to cutting-edge chip technology known as extreme ultraviolet (EUV) lithography.
Intel and Siemens have announced a three-year collaboration aimed at enhancing factory efficiency and automation, with a specific emphasis on advancing energy efficiency and sustainability.
Intel's global operations chief, Keyvan Esfarjani, stated in an interview with Reuters, "Intel has ambitious plans for expansion, but we want to ensure that we do so with a paramount focus on the efficient use of natural resources and our commitment to achieving net zero."
In an effort to better compete with industry leader Taiwan Semiconductor Manufacturing (TSMC), Intel is undergoing a multi-billion-dollar transformation in its manufacturing operations, which includes a shift to cutting-edge chip technology known as extreme ultraviolet (EUV) lithography.
The collaboration with Siemens is expected to contribute to Intel's efforts to operate its factory more efficiently, particularly in the context of the energy-intensive EUV technology crucial to advanced chip manufacturing. Esfarjani highlighted the significance of this partnership in optimising operations.
EUV lithography is a central component of advanced chipmaking, and Siemens aims to deepen its understanding of this technology through its collaboration with Intel. This knowledge transfer is expected to extend to other industries, as Siemens digital industries chief Cedrik Neike noted, "Other industries are moving in this direction; (semiconductors) are the first ones to actually explore it."
Siemens has a history of similar collaborations with major manufacturers, including Mercedes-Benz, where the company assisted in the transition to manufacturing electric vehicles from combustion engines.
Source: Moneycontrol
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