• Ino Weave

Girdle Polishing Robot

An ODM (own design manufacturing) company manufactures dedicatedly designed and programmed logic controllers (DDPLC) for OEMs. The machine is used for polishing girdle of the diamond in round shape. The electronics grain seeking module enables the machine to polish diamonds with the right grain resulting in maximum production with minimum breakages. Features: an embedded control for diamond polishing robot with 5 axis micro stepping control and 1 DC motor control; 2 high speed encoder feedback with A, B and Z sensing; load cell interface for polishing diamond with controlled pressure; serial interface with computer for setting polishing parameters; camera interface for monitoring the cutting process of diamond; LCD display interface; self diagnostic control to visualise error conditions in process; and highly accurate and sophisticated linear sensing mechanism for cutting diamond with the accuracy in microns.