Digi International to showcase latest product innovations at Electronica 2016

  • Industry News
  • Oct 26,16
Digi International to showcase latest product innovations at Electronica 2016

Minnetonka, USA, October 25, 2016 – Digi International, a leading global provider of machine-to-machine (M2M) and IoT connectivity products and services, has announced the key company activities and events taking place during Electronica. The event takes place at Messe München, Germany, November 8-11, 2016. Digi will be showcasing its solutions in Hall A6, booth 528.

During the four-day event, Digi representatives will host a series of ongoing demonstrations featuring a number of Digi’s M2M and IoT products. The company will be discussing its product innovations and will provide visitors with an early opportunity to view and buy its ConnectCore® for i.MX6UL Starter Kit, as well as offering details about its forthcoming ConnectCore for i.MX6UL Developer Kit.

“Electronica is the leading international trade fair for the electronics industry, attracting in excess of 70,000 visitors annually,” said Kevin C Riley, chief operating officer, Digi International. “It’s the ideal venue for engineers to see our latest solutions and meet Digi product experts as they evaluate options for upcoming projects.”

The ConnectCore for i.MX6UL Starter Kit for the ConnectCore for i.MX6UL SOM is a universal and powerful platform for rapid development of smart and secure connected devices. It delivers a complete hardware and software platform to create a wide range of connected devices for medical, healthcare, energy or industrial applications. The kit allows designers to address all development needs including a reference design for module integration, a prototyping platform for quickly creating proof-of-concepts, and a complete development environment to bring module-based designs to mass production, for wired and wireless connected devices.

Features include:

>> A compact 87 x 63 mm form factor with mounting options, industrial operating temperature range, 256 MB of highly reliable NAND flash, and 256 MB DDR3 memory
>> Choice of wired and wireless network connectivity through 10/100 Mbit Ethernet networking, pre-certified 802.11a/b/g/n/ac networking and Bluetooth 4.2 with Bluetooth low energy (LE) connectivity
>> Grove connectors for rapid prototyping using a wide range of off-the-shelf Grove system sensors, breakout connector with access to all key module signals, USB host/device connectivity, SD card storage, and an on-board interference-hardened stamped metal antenna, and
>> Built on the ConnectCore for i.MX6UL, the industry’s smallest, secure NXP i.MX6UL SOM with wireless connectivity, and complete Yocto Linux support and Digi TrustFence™ embedded device security framework integration.

The company is also launching Digi XBee® Cellular – newly developed for the North American market. This upcoming addition to the Digi XBee ecosystem will allow OEMs to quickly and easily integrate cutting-edge 4G LTE CAT 1 cellular technology into their devices and applications without dealing with the time-consuming, expensive regulatory and carrier end-device certifications.

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