Caliber Interconnects Accelerates High-Complexity Chiplet and ATE Design with Cadence Tools

  • Articles
  • Nov 14,25
Caliber’s advanced methodology significantly enhances the efficiency and precision of designing highly complex IC packages and dense PCB layouts.
Caliber Interconnects Accelerates High-Complexity Chiplet and ATE Design with Cadence Tools

Caliber Interconnects Pvt Ltd, a semiconductor design house specialising in advanced packaging and high-density PCB design, has announced that it has achieved accelerated turnaround times and first-time-right results for complex chiplet and Automated Test Equipment (ATE) hardware projects. The company has refined its proprietary design and verification workflow, which integrates robust Cadence solutions to optimise performance, power, and reliability from the earliest stages of the design process.

Caliber’s advanced methodology significantly enhances the efficiency and precision of designing highly complex IC packages and dense PCB layouts. By leveraging the Cadence AllegroX Design Platform for PCB and advanced package designs—which incorporates sub-drawing management and auto-routing—Caliber’s teams are able to operate in parallel across multiple circuit blocks, reducing overall project timelines by up to 80 per cent. This streamlined framework is further reinforced by a rigorous in-house verification process and bespoke automation utilities developed using the AllegroX Design Platform’s SKILL-based scripting, ensuring consistent quality and adherence to design rules.

To meet the demands of next-generation interconnects operating at over 100Gbps, Caliber’s engineers employ Cadence’s SigrityX PowerSI and SigrityX PowerDC solutions. These advanced simulation tools enable the team to analyse critical parameters such as signal loss, crosstalk, and power delivery network (PDN) impedance. By thoroughly evaluating IR drop, current density, and Joule heating, Caliber can confidently achieve design signoff, minimising the risk of costly respins and accelerating time to market for its customers.

“Our team has elevated our engineering leadership by creating a disciplined workflow that delivers exceptional quality and faster turnaround times for our customers across the semiconductor ecosystem,” said Suresh Babu, CEO, Caliber Interconnects. “Integrating Cadence’s advanced design and simulation environment into our proprietary methodology empowers us to push the boundaries of performance and reliability in complex chiplet and ATE hardware design,” he added. 

By integrating its extensive design expertise with state-of-the-art Cadence solutions, Caliber empowers customers to mitigate design risks and deliver next-generation semiconductor systems to market with enhanced speed and confidence.

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