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Hot-Pressed Boron Nitride Shapes

Hot-pressed boron nitride (BN) is compacted at temperatures up to 2000°C and pressures up to 2000 psi to form a dense, strong engineering material that may be easily machined. It is available in standard and custom shapes and has several unique properties which make it an excellent candidate to consider for a wide range of challenging applications.
Four Material Grades

• HBC & HBT
  • High purity hot pressed boron nitride
  • Diffusion bonded (no binder)
  • Low dielectric constant & loss tangent
  • Minimal moisture pick-up
  • Chemically purified (HBC)
  • Thermally purified (HBT)
• HBN
  • Boric oxide binder
  • Highest density
  • Highest strength
• HBR
  • Calcium borate binder
  • High density
  • Best moisture resistance
  
  Thermal Management of Electronic Devices
  The unique combination of electrical resistivity and thermal conductivity makes BN an ideal heat sink candidate to consider for use in high power electronic applications. Its properties generally compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, and it is typically easier to form and finish.
  High Temperature Applications
  Temperature stability and excellent resistance to thermal shock make BN an excellent candidate to consider for the toughest high temperature applications such as plasma arc welding and semiconductor processing.
  Molten Metal Handling
  BN is inorganic, inert and is not wet by most molten metals and slags, nor does it react with halide salts or other reagents. These characteristics, combined with low thermal expansion, may make it an excellent candidate to consider for use in interface materials used in various molten metal processes.
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