• Integrated Process Systems

Laser Line Scanner

Integrated Process Systems offers Laser Line Scanner. The scan control 2800 makes use of the triangulation principle for the two-dimensional acquisition of profiles on the most varied target surfaces. In contrast to the familiar point laser sensors, a line optical system projects a laser line onto the surface of the measurement object. The diffusely reflected light from the laser line is replicated on a CMOS matrix by a high quality optical system and evaluated in two dimensions (light intersection method). Apart from the distance information (Z axis), the exact position of each point on the laser line (X axis) is also acquired and output by the system. With moving objects or with a traversing sensor, 3-D representation is also possible. This scan control consists of a compact sensor and an intelligent controller, which are connected together with a connection cable, which can vary in length. The controller outputs both the measurements from both axes as well as linked values. The user can also select from numerous evaluation functions. Scan control features high scanning rates and high measurement accuracy. The geometry of the measuring field (height Z and width X) can be varied and can be adapted to the measurement application. With fast moving profiles high accuracy is achieved for the complete profile using a high-speed shutter. While the matrix is being read out, the next image is recorded. Consequently, higher light intensities are realized with high profile frequencies. As an option, scan control can carry out a partial surface adaptation via an innovative PSC intensity control. This facilitates more precise measurement with difficult surfaces. This scan control is employed for profile and contour measurement in running production processes for continuously produced products (extrusion, rolling, drawing, etc.) or for single parts (individual items). The typical application examples are: profile acquisition on tires, turned parts, railway rails; robot guidance (welded seams, jointing processes); co-planarity measurement on electronic components; flatness measurement on sheet strips (dents, cutting or stamping burr); door gap alignment in automotive manufacture; measurement of the width and depth of grooves.