• Dynapar Corp

Harsh Duty Optical Encoders

The Module

At the heart of this technology is the photo module, comprised of an ASIC, LED, lens, and lead frame. The chip (or ASIC) is a single phased array opto-ASIC that eliminates the need for potentiometers and a multitude of discrete components. Phase quadrature and symmetry are designed into the ASIC at the wafer level, eliminating signal drift due to time and temperature. The LED is regulated to only 20% of its power rating, increasing life and subsequently MTBF. The ASIC, LED, and lens are embedded in a molded lead frame which comprises the complete sensing module. The phased array ASIC and collimating lens allow for the use of a metal or Mylar disc and a large "air gap" of 0.030 inches, a factor of 10 times that of many conventional glass disc encoders. In addition, no separate masks are required, helping to assure performance over a wide temperature range of -40 to +100 degrees centigrade.

The Disc

The discs