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Slicing Systems
Slicing Systems
Speedfam offers Slicing System. This is used for the development and production of high precision machines with band and wire saw and OD and ID system for use in the solar (photovoltaic), semiconductor and optical industries. The product range includes diamond multi wire saws for high production and precise application, diamond single wire saw for small quantities and precise application, capstan and profile saws for your individual application. This is suitable to cut a wide range of material such as sapphire, glass, SiC, ceramics, GaAs, LiNbO3, quartz, Ge, etc.