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Solder Paste Height Measurement System
Solder Paste Height Measurement System
The VM400 is the latest development in True 3D measurement technology. Integration of a larger Field of View (FOV), while still retaining .07 mil resolution, allows operators to measure everything from 0201's and micro-BGA'S to your largest applications. With it's Windows® XP interface, the VM400 is easy to learn and use, making it an exceptional value for the SMT manufacturer concerned with improving printing and production yields. measurement process eliminates operator errors and offers excellent measurement repeatability. Today's contract manufacturers are facing ever changing board designs, along with smaller component sizes. This places a greater emphasis on the solder paste printing process, and requires the engineer to have a control process in place. The ease, as well as the superb accuracy and repeatability, of the VisionMaster solder paste inspection system makes it a perfect fit for the company with either one or multiple lines. The system include VM400 3D Camera Assembly, Anti-static work surface, 2.5+ GHz CPU and SVGA Monitor, Large Work Surface, Hardware/Software Reference Manuals. Options available are Siemens® SPC Software, NIST Traceable Standard, Manual X-Y Stage.
Product & Technology News
- Fully automated solder paste height/volume measurements
- Color Image for easy operator viewing
- Color 3D Profiles of Measured Features
- Accurate and repeatable measurements regardless of substrate color and reflectivity
- Windows XP® User Interface
- One-Year, End-User Warranty with Technical Support
