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Putty Material
Putty Material
TIM-Putty is ‘Ultra Soft†and highly conformable paste- type gap filler. Its “ultra soft†consistency assures efficient heat transfer between delicate parts where minimum pressure can be tolerated. This Form-in-place gap filler is ideal for applying any thickness with little or no stress. It is designed to provide a thermal solution for the recent trends of integrating higher frequency electronics into smaller devices. TIM-Putty easily forms and adheres to most surfaces, shapes and sizes of components with very low compression force. Non-Silicone formulas avoid silicone contaminations to delicate devices. It can be easily dispensed from cartridges or pail using pneumatic dispenser.
TIM-Putty is used to fill air gaps between components or PC boards and heat sinks, metal enclosures and chasses. TIM-Putty materials allow the designer to be less concerned of CTE stresses during thermal cycling.