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Advanced Cooling System
Advanced Cooling System
Advanced Cooling Solutions for electronics uses patented Macrospray macrolaminate technology and advanced material bonding techniques. These solutions include traditional liquid flow through coldplate cooling systems, or more advanced designs incorporating single- and two-phase spray impingement solutions. These systems utilize various proprietary components including advanced coldplates, smart pumps, and Macrospray nozzles. These innovative systems provide extreme heat removal, they give electronics designers the flexibility of working with more compact, conformal thermal solution packaging.
Product & Technology News
- Aircraft avionics
- High-end computing
- High-power lasers
- Medical imaging equipment
- Military ground vehicle electronics
- Point-of-load converters
- Power conversion and inversion
- Power distribution
- Radar and antennas
- Telecommunications equipment
- Unmanned aerial vehicles
- Weapons systems
- Self-contained, closed-loop systems containing coolant, control system, smart pump, filter, accumulator, heaters for cold-system startup, and various devise and board-level heat-absorbing technologies.
- Board-level thermal solutions, including liquid-flow-thru and spray cooled modules adapted to the particular application and performance requirements.
- Spray cooling solutions for extremely demanding heat removal applications (e.g. spray impingement and two phase cooling within 1†pitch modules).
- Systems adaptable to existing platform (vehicle) liquid systems.
- Thermal solutions accommodate various board types, including VITA standards for VME, VXS, and VPX (VITA 46/48) with scalable technology sized for the required amount of cooling in a particular application.
- Solutions designed to be two-level maintenance compatible; users can easily change out the electronics modules or the pump module without needing special conditions, tools, or specialized technical knowledge.
- Modular design approach allows the base electronics chassis to be used through several tech-refresh cycles even when changing from conduction to liquid cooling, considerably lowering the system’s total cost.
- Systems for ruggedized military and commercial aerospace implementation for shock, vibration, and acceleration requirements to MIL-STD-810F, EMI/EMC requirements to MIL-STD-461E, and operation from -40 to 85 degrees Celsius (storage to 125 degrees Celsius).
- Operational from -1,500 to 70,000 feet altitude and compliant with the humidity, salt fog, fungal growth, thermal shock, sand, and dust requirements of VITA 47.
- Mechanical design and thermal analysis expertise, including finite element analysis and computational fluid dynamics.