TDK showcases embedded technologies at Embedded World 2019

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TDK showcases embedded technologies at Embedded World 2019

TDK showcases embedded technologies at Embedded World 2019

Technical Articles
Mar 01,19

The solutions ranged from embedded motor control by TDK-Micronas, power supply solutions by TDK-Lambda, passive components for internet of things applications by TDK Europe, as well as motion, sound and ultrasonic sensor solutions by InvenSense.

TDK showcases embedded technologies at Embedded World 2019

TDK Corporation displayed its latest product innovations for many kinds of embedded technologies at Embedded World 2019 Nuremberg, Germany. Its group companies TDK-Micronas, TDK-Lambda, TDK Europe, and InvenSense presented magnetic sensors and embedded motor control solutions as well as power supply solutions and components for internet of things (IoT) applications at booth 438 in hall 3A.

Embedded motor control and magnetic sensors by TDK-Micronas

The HVC 4420F by TDK-Micronas enables the direct drive of small brush-type, stepper, or brushless electric motors in smart actuators. With flash memory extended to 64 KB and SRAM to 4 KB, the HVC 4420F meets increased functional and diagnostic demands. Currently, OEMs use own ideas and approaches on diagnostics, such as for sensor data fusion strategy or actuator status surveillance. To ensure the required data analysis, software routines have to be implemented. Due to its larger memory and the built-in diagnostic feature set, the HVC 4420F offers the storage capacity and processing capability to execute these actions which are unique in the environment of smart actuators. Furthermore, TDK-Micronas has shown its extensive portfolio of magnetic field sensor solutions, based on the so-called hall effect, for automotive and industrial applications.

Power supply solutions by TDK-Lambda

Utilising DSP (Digital Signal Processing) technology, TDK-Lambda Genesys+ series of high power density programmable DC power supplies provide improved efficiency, performance and functionality compared to existing products. The Genesys+ series addresses a very broad market, including component, aerospace and automotive testing, semiconductor fabrication, water treatment, plating and solar array simulation. Housed in a 1 U high, 19” (483 mm) wide rack package, the 5 kW model offers the leading power density and, at less than 7.5 kg, lightest weight in the industry. In addition, TDK-Lambda presented its 600W GXE600 series rated AC-DC power supplies. In a 1U high package, these convection-cooled products have the ability to be digitally programmed across a wide range. The GXE600 series can be operated as a 24 V or 48 V fixed output supply, or programmed to provide constant voltage, constant current (CVCC) source.

Passive components by TDK Europe

TDK Europe gave an overview of its product range of TDK and EPCOS components for IoT applications. This included RF components, multilayer and thin-film inductors, ceramic capacitors, SESUB modules, piezo actuators with haptic feedback and wireless charging coils. One of the highlights is a live demonstration of CeraCharge, the world’s first solid-state SMD rechargeable battery. This new technology combines a relatively high energy density and smallest volume with the safety and high volume manufacturing benefits of ceramic multilayer components. CeraCharge can be used in a wide range of applications, particularly in IoT devices and systems.

Motion, sound, and ultrasonic sensor solutions by InvenSense

InvenSense’s solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, microphones, and ultrasonic 3D-sensing with proprietary algorithms and firmware that intelligently process, synthesize and calibrate the output of sensors, maximising performance and accuracy. At Embedded World, InvenSense presented capacitive pressure sensor solutions, analogue and digital MEMS microphone solutions, new digital ultrasound transceiver, showcasing 6-DoF controller tracking system, and InvenSense UltraPrint, an ultrasound fingerprint touch sensor solution for mobile and IoT products.