SAP launches next phase in Distributed Manufacturing Initiative

  • Industry News
  • Sep 22,16
SAP launches next phase in Distributed Manufacturing Initiative

Las Vegas, September 20, 2016 – SAP SE has launched the next phase in its initiative to transform industrial 3D printing into a seamless distributed manufacturing process by opening up the program so other companies can benefit from a first-mover advantage. With a growing list of co-innovation customers, SAP and UPS launched a website to expand the early phase of the program to a select number of co-innovation customers and partners worldwide to collaborate with SAP to test, validate and improve the model. This announcement was made at the SAP TechEd conference taking place September 19-23 in Las Vegas.

SAP and UPS previously announced a distributed manufacturing collaboration to connect the manufacturing floor to the customer door. The collaboration integrates SAP solutions for the extended supply chain and Internet of Things with the UPS additive manufacturing and logistics network. Customers co-innovating in the early-stage production environment to streamline supply chains and get products to market faster and more cost-effectively as part of their digital strategies include Airbus APWorks, Fast Radius, HP Inc., Krones, Linear AMS, Moog Inc., Sealed Air Corporation and Stratasys.

“The successful transition of 3D printing from prototyping to manufacturing requires integration with business IT systems. HP understands the importance of end-to-end integration to maximize efficiency and technology adoption and is joining the SAP co-innovation program to help bring this to life,” said Scott Schiller, vice president, 3D market development, HP. “Powered by HP Multi Jet Fusion technology, HP delivers a manufacturing-ready solution for end-part production as well as an open software platform to connect to business IT systems. With leadership from SAP and collaboration with other innovators in the industry, 3D printing will more quickly move into mainstream manufacturing and streamline supply chains.”

Registration for the early adopters program is now open globally through January 2017, including Asia and Greater China, which are now served by the expansion of the UPS 3D printing network. Participating companies can explore distributed manufacturing benefits including reduction in parts inventories, cost-effective short production and prototype runs, quick delivery of parts, and access to 3D printing capabilities. To learn more about the early adopters program and how to register for participation, interested companies can visit here.

“SAP and UPS are leading the way with their distributed manufacturing solution,” said Rick Smith, co-founder and CEO, Fast Radius. “This is a critical component that enables Fast Radius to realize its vision of a globally distributed network for on-demand manufacturing.”

“SAP Distributed Manufacturing can enable unprecedented opportunities to revolutionize design, manufacturing, logistics processes and business models,” said Hans Thalbauer, senior vice president, extended supply chain, SAP. “We are bringing together the innovative power of our customers and partners with SAP in this exciting next phase of our initiative to extend our reach and enable our vision for digital manufacturing.”

Related Stories

Automation & Robotics
Future Factory Expo CXO Roundtable Charts Smart Transformation for SMEs

Future Factory Expo CXO Roundtable Charts Smart Transformation for SMEs

During the roundtable, hosted by Smart Manufacturing & Enterprises (SM&E) and The Future Factory Expo 2026, industry leaders outlined how SMEs can use practical digitisation, automation, skilling an..

Read more
Automation & Robotics
ARC India Forum Spotlights AI-Led Industrial Transformation

ARC India Forum Spotlights AI-Led Industrial Transformation

ARC Advisory Group’s 24th India Forum brought together 300-plus leaders to examine how AI is transforming industrial operations, manufacturing and supply chains.

Read more
Electrical & Electronics
IESA Backs Rs 625 billion PLI 2.0 for Electronics Manufacturing

IESA Backs Rs 625 billion PLI 2.0 for Electronics Manufacturing

IESA has welcomed the Rs 625 billion PLI 2.0 scheme, citing its potential to sustain manufacturing growth and advance India’s US$400 billion electronics goal.

Read more

Related Products

Liquid Ring Vacuum Pumps/Compressors

Compressors and Allied Equipment

Aeromatic Engineering Private Limited offers a wide range of liquid ring vacuum pumps/compressors.

Read more

Request a Quote

Hot Wheel Bearing

Bearings, Bushings, Wheels and Gears

SICCO Engineering Works offers a wide range of hot wheel bearing. Read more

Request a Quote

Kusam-meco DC Power Supply Model Km-ps-3020 Abf / Km-ps-3030 Abf

Power Supplies, Batteries & Accessories

<p>Kusam Electrical Industries Ltd offers Kusam-Meco DC power supply model KM-PS-3020 ABF/ KM-PS-3030 ABF</p> Read more

Request a Quote

Hi There!

Now get regular updates from IPF Magazine on WhatsApp!

Click on link below, message us with a simple hi, and SAVE our number

You will have subscribed to our Industrial News on Whatsapp! Enjoy

+91 84228 74016

Hi There!

Now get regular updates from IPF Magazine on WhatsApp!

Click on link below, message us with a simple hi, and SAVE our number

You will have subscribed to our Industrial News on Whatsapp! Enjoy

+91 84228 74016