5 Riveting ways multi-die systems revolutionise chip manufacturing

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5 Riveting ways multi-die systems revolutionise chip manufacturing

5 Riveting ways multi-die systems revolutionise chip manufacturing

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Oct 23,23

Multi-die chips are emerging as the future of chip manufacturing as AI and machine learning explode in popularity. Emily Newton explains the benefits of multi-die chip manufacturing for developers, manufacturers and customers.

5 Riveting ways multi-die systems revolutionise chip manufacturing

Multi-die chips can deliver powerful, energy-efficient processing in a small, customizable package. The modular nature of these systems is transforming manufacturing as product developers search for ways to expand processing power capabilities. What benefits does multi-die chip manufacturing have for developers, manufacturers and customers?

1. Easy component customisation

Modularity is one of the biggest advantages of multi-die chips over conventional monolithic versions. Since each die is a distinct unit rather than part of a homogenous whole, there is much more freedom for customisation. As a result, they are ideal for designing unique products optimized for specific or niche use cases.

Multi-die chip manufacturing is much more flexible. Customers can pick and choose specific components they want without dramatically impacting the process or cost. Likewise, they can select parts that complement each other, leading to better end-product performance.

A highly flexible chip design process is becoming increasingly important as manufacturing rapidly reaches the reticle limit. Manufacturers and product developers are trying various strategies to increase chip capabilities, such as fusing two high-power monolithic chips. Multi-die chips navigate this challenge by maximizing optimization through flexible component selection.

2. Localised power management

Energy efficiency is a critical performance metric in today's semiconductor industry. AI and machine learning are pushing the processing capabilities of chips, which require high energy efficiency to achieve peak performance and maintain low temperatures.

The modular nature of multi-die chips can significantly simplify energy efficiency thanks to localised power management. One of the main design challenges with conventional monolithic chips is a lack of adaptable power distribution. More resource-intensive components may not get as much energy as they need, causing strain on the entire chip and creating performance bottlenecks.

Multi-die chips have localised power management since each component is distinct. This allows manufacturers to optimize energy consumption from one die to another rather than trying to optimize for the system as a whole. It's more flexible than the one-size-fits-all power management approach needed for conventional monolithic chips.

3. More efficient, cost-effective manufacturing

Many factors impact manufacturing efficiency and cost, from tools and processes to product design. Thanks to their modularity, multi-die chips lend themselves well to highly efficient, cost-effective development.

Manufacturers can produce individual components for each multi-die chip separately before integrating them. This provides more flexibility with the tools and processes they use. Companies can customize each part's production process without adversely affecting others.

This high level of flexibility creates many opportunities to save money and optimise the manufacturing process. For example, die-cutting delivers tight tolerances on PCBs and offers plenty of customization. However, certain types of cutting dies are better suited for different tasks. For instance, tougher materials require a solid die, while more flexible, malleable materials work best with a flexible one.

Product developers can customize the multi-die chip manufacturing process for each component. They can use a solid cutting die for one part and a flexible die for another. They don't need to follow a one-size-fits-all process, which allows for more efficient production.

Well-optimised manufacturing processes also reduce waste, which saves even more money. This is especially important today as manufacturers grapple with supply chain shortages and delays. Multi-die chips lend themselves to more efficient resource utilisation, allowing companies to get more value from each chip.

4. Improved affordability

Multi-die chips are making high-power computing more affordable and accessible for end customers. The manufacturing process uses energy and resources more efficiently and customers don't have to pay for components they don't need. They can get a chip with the exact specs their application requires.

Affordability is an increasingly vital metric for chip manufacturers today. The CHIPS Act and other semiconductor manufacturing initiatives will help resolve the global chip shortage and lower prices. However, in the long term, manufacturers must find ways to scale high-power chip manufacturing at a cost the masses can afford.

Multi-die chips offer a solution that suits the growing demand for AI applications. This approach allows manufacturers to stack chiplets to build high-density systems of chips.

They can pack more computing power into each PCB without significantly increasing its size. This keeps the cost low while increasing processing power and scalability. Plus, the ease of customization on multi-die chips makes custom, small-batch solutions more affordable.

5. Higher processing power ceiling

AI and machine learning are pushing the capabilities of conventional chip manufacturing. Multi-die chips are an ideal solution due to their high degree of optimization and power management. These traits effectively give them a greater maximum processing power than conventional alternatives.

Many industry experts consider multi-die chips a cornerstone of AI chip technology today. They can support AI accelerators, which manage the resource-intensive workloads of AI applications, improve scalability and lower latency.

Multi-die chips with AI accelerators are also significantly more energy efficient than traditional alternatives, so they can handle intense workloads while maintaining a low operating temperature. All these features make multi-die chips ideal for AI and the future of computing.

The future of multi-die chip manufacturing

Multi-die chips are emerging as the future of chip manufacturing as AI and machine learning explode in popularity. They offer flexibility, affordability, efficient power management and high processing power in a small, customizable package. The amazing capabilities allow manufacturers to expand beyond the reticle limit to deliver the next-gen computing power their customers need.

About the author:

Emily Newton is a tech and industrial journalist and the Editor-in-Chief of Revolutionized Magazine. Subscribe to the Revolutionized newsletter for more content from Emily.