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SMD Glue
SMD Glue
A and A Global Resources Pvt Ltd offers SMD Glue for extreme strong bonds. Three Bond 2217H is a single component epoxy developed for bonding electronic chips, which can cure when heated at 80° C. Its properties are designed to allow the resin to be applied onto parts by syringe application.
- Fixing of chip onto PCB, chip-bonding (syringe application)
- Bonding, fixing and sealing of electronic parts
- Bonding and sealing of various metal and plastic types
- Syringe application
- Excellent thixotropic property
- Low temperature cure
- Rapid cure
- Excellent bonding ability
- Excellent stability in application
- Able to maintain the shape after application
- Curing at temperature of 80° C and above
- Curing at temperature of 120° C and above
- Excellent adhesion to various metals and plastics
IPF SMD Glue
SMD Glue
SMD
Glue
A and A Global Resources Pvt Ltd
A and A
Global
Resources
A and A Global
Resources Pvt Ltd
A and A Global SMD Glue
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