• Master Bond Inc

Adhesive

Master Bond EP30LTE adhesive offers reduction in the thermal expansion coefficient of epoxies and dimensional stability. This 2-part epoxy system cures at room temperature or more rapidly at elevated temperatures. Its thermal expansion coefficient is less than 12 x 106 inches/inch/C. Shrinkage upon cure is less than 0.0002 inch/inch. EP30LTE is recommended for applications exposed to repeated rapid environmental changes. This adhesive produces high strength durable bonds to both similar and dissimilar substrates.