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Thermally Conductive Epoxy Encapsulating & Potting Compound
Thermally Conductive Epoxy Encapsulating & Potting Compound
The Thermally Conductive Epoxy Encapsulating & Potting Compound is 100% solids. This compound is formulated with undiluted Bis F resin for superior physical properties, and pigmented with high purity aluminium oxide pigment to provide excellent thermal conductivity at reasonable cost. Pigmented black for excellent thermal absorption and emission.
Product & Technology News
- Provides superior protection from impact, shock, conductivity, moisture, abuse, chemicals, and analysis
- Two part epoxy, with a 1 to 1 mixing ratio by volume
- Two hour working time
- Suitable for large production runs
- Excellent machining properties
IPF Thermally Conductive Epoxy Encapsulating Potting Compound
Thermally Conductive Epoxy Encapsulating Potting Compound
Thermally Conductive
Epoxy
Encapsulating
Potting Compound
Thermally
Conductive
Encapsulating Compound
Potting
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