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High Temperature Epoxy Encapsulating and Potting Compound
High Temperature Epoxy Encapsulating and Potting Compound
The High Temperature Epoxy Encapsulating and Potting Compound is used for encapsulating and potting electronics in high temperature environments, aggressive chemical environments, or where improved technology protection is desired. Bonds to a wide variety of substrates, including metals, glass, ceramics and many plastics.
Product & Technology News
- Use in electronic assemblies to prevent vibration damage
- Encapsulate circuits for the purpose of technological protection
- Extreme physical strength and chemical resistance
- Suitable for extreme environments, such as submersion in salt water, acids, bases, fuels, and alcohols
- Protects against strong vibrations, abrasions, and direct physical impact
- Extremely difficult to remove - grants incredible technology protection
- Maximum service temperature of 275°C (527°F)
IPF High Temperature Epoxy Encapsulating and Potting Compound
High Temperature Epoxy Encapsulating and Potting Compound
High Temperature
Epoxy
Encapsulating
Potting Compound
High Temperature Epoxy
Encapsulating Compound
Potting
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