• Interplex Industries

SMT Card Edge Connector, Solderless

Interplex Industries offers a new SMT Card Edge Connector System based on a discrete SMT component that creates a solderless press-fit edge card connector system for daughter card applications. Features: Interplex-tested and proven 0.64 mm press-fit technology; packaged in 16 x 4 mm pitch EIA tape for compatibility to standard high-speed pick and place equipment; strong through-hole SMD soldered interface for high mechanical strength; and high conductivity material for up to15 A per contact. Basic specifications: maximum operating temperature – 125°C; contact resistance – 1 m? max press-fit interface; 30 N minimum retention force per each press-fit contact; packaging – 16 x 4 mm pitch tape and reel on 13” diameter reel; and reeled continuous metal stamping packaging option.