Semiconductor Chips

Semiconductor Chips


Diotec produces Semiconductor Chips by using its own “Plasma-EPOS” process. In contrast to the normally used, aggressive acids for etching (cleaning) of the silicon edges, etching and passivation is done under nearly vacuum conditions by means of a plasma process. A double passivation by silicon nitride (glass like, electrically insulating) and polysiloxane (flexible, mechanically compensating) provides high reliable products. All Diotec components are compliant to EU directives “RoHS” (Reduction of Hazardous Substances), “WEEE” (Waste Electrical and Electronic Equipment) and “ELV” (End of Life Vehicles). The quality of components is determined by statistical methods and is quoted as a maximum permissible percentage of defectives per shipment, found out by sampling tests which are as a rule part of the supply contract. Sampling tests are carried out according to agreed sampling procedures basing on statistical methods.

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