• Electronic Enterprises (India) Private Limited

System For Solder Paste Inspection On Pcbs – 3d Laser Based

Electronic Enterprises offers 3-D laser-based in-line AOI systems from GSI Group – USA, for both solder paste inspection after screen-printing and component placement inspection after component placement. These systems, inspecting 100% of the surface while production is in full progress, provide accurate and easy-to-evaluate data to facilitate improvement of the process. In-line component inspection in a high volume-manufacturing environment is always very challenging. Inspection by traditional camera based 2D AOI frequently result in production constraints due to excessive false failures. There is now an effective alternative. The SVS™ 8000 series solder paste inspection system from GSI Group uses a patented 3D scanning laser to generate synthetic images, as the system is not sensitive to colour or brightness variations it can greatly reduce the number of false failures. This 3-D technology enables precise height and volumetric measurements, the best indicators of final solder joint quality. For component in