• Electronic Enterprises (India) Private Limited

PLATING/COATING THICKNESS MEASURING INSTRUMENT

Para Electronics offers Plating/Coating Thickness Measuring Instrument, Model SIDET. It is a simple destructive tester that works on coloumetric principle, having high accuracy and repeatability. Simple, true to its name, SIDET offers very easy operation. Use of pre-tested 1.5 mm or 2.5 mm diameter gasket supplied with SIDET ensures accurate results in thickness measurement of electroplated samples of various size and shapes. It has a unique feature of plate/base combination (PBC) plug. Different PBC plugs are supplied for measurement of different plating. Plating thickness on fixed length wires can be measured by using wire cell assembly.