• Heraeus Instruments GmbH

Automatic Vacuum Soldering Unit For High Performance Semiconductor Structural Components

Heraeus Instruments has introduced an automatic vacuum soldering unit to meet the high requirements of oxidation free and flawless soider connections since the quality of connections of the basic materials significantly determined the reliability and life of sensitive electronic, optic and fine mechanic components. During the soldering process, the surrounding conditions decisive in high quality solder connections are maintained exactly and reproducibly. Thus the unit is suited for the mass production of hilh performance semiconductor structural components. The soldering is done at temperatures between 200 and 450?C under non-inflammable protective gas. The oxygen containing corrosive gas is sucked off by evacuation of a hermetically sealed vacuum receptacle and replace by the inert gas. The actual soldering takes place in vacuum. The continous light stream produces an excess pressure of about 1,020 mbar preventing the air from outside entering the receptacle. The deposits here, in which the soldering -material is present In a special form, are electrically heated and conducts the heat for soldering directly to the material.