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Tactilus Heat Sink
Tactilus Heat Sink
Tactilus Heat Sink enables research and design engineers to quickly and precisely test and correct the surface contact and pressure distribution between the heat sink and semiconductor. Even a slight warping of the heat exchange structure or reduction in surface contact area can have a profound effect on cooling efficacy. If the pressure distribution is not uniform, heat conduction will be low, and the electronics may overheat. It collects and processes sensor data using powerful, easy-to-use, Windows®-based software that performs the following tasks :
- Creates pressure vs. time graphs and histograms
- Performs 2D, 3D and 360 degree image rendering and region of interest scaling
- Displays maximum, minimum, and average pressures and does force integrations
- Prepares reports through export to Excel, ASCII, or Access formats
- Total sensing area: 2 × 2 inch
- Scan speed: Up to 1,000 Hertz
- Operating pressure range: 0 to 100 psi (0 to 7 kg/cm2).
- Accuracy: ± 10%
- Repeatability: ± 2%
- Hysteresis: ± 5%
- Non-linearity: ± 1.5%
- Can be tested, manipulated, and repositioned in real-time, speeding the trial and error process and eliminating the need for additional assembly.
- Tactilus also provides the pressure data needed for FEA simulation predictions.
- The sensor pad has 625 resistive sensing points arrayed on a 25 × 25 grid.
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