• Monad Electronics

Induction Bonding

Induction Bonding and curing includes the processes of joining a metal or conductive material to a rubber or plastic material with or without a third bonding agent. Induction bonding requires accurate heat control while still reaching temperatures that cause bonds to form. Monad offer control of the process through optical pyrometry ensuring repeatability and reduced waste. The company can also integrate into both in line and cell type production environments as the systems have rapid and accurate heat cycles.