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TDK introduces world’s smallest Point-Of-Load DC-DC converters
Industry News- Mar 19,19
To be premiered at APEC 2019 from March 18 to 20, the converters are suitable for applications such as big data, machine learning, artificial intelligence (AI), 5G cells, IoT and computing enterprise
TDK Corporation has launched the new series of µPOL DC-DC converters, the industry’s most compact and highest power density point-of-load solutions for applications such as big data, machine learning, artificial intelligence (AI), 5G cells, IoT and computing enterprise.
Rather than using side by side discrete integrated circuit (IC) and discrete inductor (L) the new FS series integrates the IC and inductor in a compact configuration which offers a high-density solution for space-constrained applications requiring a low-profile power source.
At 3.3 x 3.3 x 1.5 mm, they minimise the required external components, retaining the highest possible performance while offering a simplified design for ease of integration. This family can deliver a high density solution of 1 watt per mm3, while offering 50 per cent less solution size than the other products available in its class. As a result, this minimizes system solution cost, reduces board size and assembly costs, as well as BOM and PCB costs. It operates at a broad junction temperature range, from -40 °C to 125 °C. Mass production of FS1406 is expected to begin in Q3 2019.
TDK has been developing patents related to these innovations (US 9,729,059 and US 10,193,442) over several years. µPOL were developed by TDK’s group company Faraday Semi. These new solutions incorporate high-performance semiconductors in advanced packaging technologies such as semiconductor embedded in substrate (SESUB) and advanced electronic components to achieve unique system integration in a smaller size and lower profile by 3D integration. This integration allows TDK to deliver higher efficiency and ease of use at a lower total system cost to what is currently available today.
μPOL technology includes a DC-DC converter placed in the vicinity of complex chipsets such as ASICs, FPGAs and others. By minimising the distance between the converter and the chipset, the resistance and the inductance components are minimised, allowing fast response and accurate regulation with dynamic load currents.
The product family is rated for industrial application, is lead free and has ROHS compliance. TDK will be showcasing its µPOL technology at APEC 2019 from March 18 to 20 at the Anaheim Convention Centre in Anaheim, CA at booth 811.
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